Foxconn thermally conductive silicone based compound is a one component paste like interface material,never dry;it is designed for general applications,to conduct heat from heat generating devices to heat sinks or chassis.The compound is heavily filled with blended thermally conductive metal oxide but remain non-electrically conductive property.

Foxconn grease has low bleeding, good wetting and slow flow properties to penetrate into air pockets after clamping.It is very stable in high temperature,no dry out and separation,up to 200 ° C .

It can be applied by screen printing,dispensing. Thermal Conductance: >30x104W/m?. ° C (1.001 inch layer)

Thermal Conductivity : <0.005 ° W/mk

Extended temperature limits: -45 ° C ~ +200 ° C

Thermal Resistance: <0.005°C ¨C in - /Wat t

Foxconn grease is sold in 1 tube. The tube contains enough compound to cover at least 4 to 7 small CPU cores, or 2 to 3 large CPU cores.